Union City opens first U.S. center dedicated to advanced semiconductor packaging

Union City, Calif., marked a milestone in the global race to build artificial intelligence hardware on Tuesday, cutting the ribbon on a research and development center devoted to advanced semiconductor packaging. It is the first facility in the United States dedicated to this stage of chip production, a key step in making the semiconductors that power everything from AI servers to smartphones.

Operated by Japanese chemical company Resonac, the center opened after four years of planning. Its work focuses on how chips are assembled—advanced packaging techniques that have become critical as AI systems demand ever more complex and powerful processors. Strengthening this segment of the supply chain has been a priority in the United States as the pace of AI adoption accelerates.

“We hope it’s not only going to benefit the customer and the companies that use those chips but it’s also going to bring more jobs to Silicon Valley and to Union City,” said Gloria Ortega, the city’s economic development manager. Resonac President and CEO Hidehito Takahashi said the company chose Silicon Valley for its speed and culture.

“Silicon Valley has this unique atmosphere of fast-paced work compared to, let’s say, Japan, which is a little slower,” Takahashi said.

“So we would like to have it here so that we can do our fast-paced turnaround for hyperscalers.” He described the opening as “a milestone in industry.” Representatives from Union City, the Governor’s Office and Japan attended the event, where speakers highlighted U.S.–Japan collaboration as both countries compete in the global chip race.

“We really hope this facility will foster our exchange of new ideas and technology between the United States and Japan and fostering the bond of our two countries,” Takahashi said. With the center now open, Union City positions itself as a player in supporting advanced semiconductor technology as competition for AI-era manufacturing capacity intensifies.